SC1752 Raspberry Pi Accessories

The aluminum heat sink is specially designed for Compute Module 5 and is supplied with thermal pads to ensure maximum heat transfer from the CPU, memory, wireless module (if available) and eMMC memory (if available) to the heat sink. The heat sink provides for an effective dissipation of the generated heat, WAS improves the thermal stability and performance of the Compute Module 5. The supplied thermal pads maximize the contact between the components and the heat sink to ensure efficient heat dissipation.

This text is machine translated.,The aluminum heat sink is specially designed for Compute Module 5 and is supplied with thermal pad